● Model: PT-15S
● Power supply: AC220V
● Working current: the machine working current is not greater than 1.2A (without vacuum pump)
● RF power supply: 0-600W
● RF frequency: 40KHZ or 13.56MHz optional (offset less than 0.2KHz)
● Frequency offset: less than 0.2KHz
● Characteristic impedance: 50 ohms, automatic matching
● Vacuum degree: 30Pa-100Pa
● Gas flow: 10-100ml / min (adjustable)
● Process control: MCU automatic and manual mode
● Cleaning time: 1-6000 seconds adjustable
● Power size 10% -100% adjustable
● The cavity size is 200mm × 150mm × 400mm
● Dimensions: PT-15S type _650 * 520 * 500
● Weight: 45Kg
● Vacuum pump: 2XZ-6
● Vacuum chamber temperature: less than 65 ° C
● Cooling method: forced wind
Vacuum plasma cleaning machine:
● 1, cleaning the object after the plasma cleaning is dry, do not need to be dried and then sent to the next process. Can improve the efficiency of the entire process line processing;
● 2, plasma cleaning allows users to stay away from harmful solvents on
the human body damage, but also to avoid the wet cleaning easy to wash
the object of cleaning problems;
● 3,
to avoid the use of trichloroethane and other ODS harmful solvents, so
that after cleaning will not produce harmful pollutants, so this
cleaning method is environmentally friendly green cleaning method. Which in the global attention to environmental protection in the case of more and more obvious its importance;
● 4, the use of radio waves generated by the high frequency of plasma and laser and other direct light is different. The
directionality of the plasma is not strong, which makes it possible to
penetrate into the fine pores of the object and the inside of the recess
to complete the cleaning task, so there is no need to consider too much
the shape of the object being cleaned. And the cleaning effect of these difficult parts is similar to or even better with the effect of freon cleaning;
● 5, the use of plasma cleaning, cleaning efficiency can be greatly improved. The entire cleaning process can be completed within a few minutes, so the characteristics of high yield;
● 6, plasma cleaning need to control the vacuum is about 100Pa, this cleaning conditions are easy to achieve. So the cost of the device is not high, coupled with the cleaning
process does not require the use of more expensive organic solvents,
which makes the overall cost is lower than the traditional wet cleaning
process;
● 7, the use of plasma cleaning, to avoid the cleaning fluid transport,
storage, emissions and other treatment measures, so the production site
is easy to maintain cleanliness;
● 8,
plasma cleaning can be handled regardless of the object, it can handle a
variety of materials, whether metal, semiconductor, oxide, or polymer
materials (such as polypropylene, polyvinyl chloride,
polytetrafluoroethylene, poly Imines, polyesters, epoxies, etc.) can be treated with a plasma. So it is particularly suitable for materials that are not resistant to heat and are resistant to solvents. But also can be selectively on the material as a whole, local or complex structure of the part of the cleaning;
● 9,
in the completion of cleaning and decontamination at the same time, but
also can improve the surface properties of the material itself. Such
as improving the wetting properties of the surface, improving the
adhesion of the film, which is very important in many applications.
400 0061 1152CN
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